“Flex Printed Circuit Fabrication”


Presenter: Jerome Larez, Applications Engineer at MicroConnex

 Dec. 07, 2018  11:30am to 1:30pm

 

Abstract:

Jerome’s presentation will focus on flex printed circuit (FPC) fabrication. He will discuss common materials used in FPC fabrication, including stiffeners and coverlays. Jerome will outline FPC fabrication techniques, how to better communicate your design requirements to fabricators, and some of the dos and don’ts for FPC design.

 

Speaker Biography:

Jerome Larez has over 20 years of experience in PCB fabrication. He started his career in 1996 as a production technician at Southwest Circuits. He worked in multiple production areas and in 2001 started an engineering support position at Prototron Circuits. In addition to engineering support Jerome worked as an inside salesperson as well as a production planner. He then began working as an outside salesperson for Prototron Circuit in 2015. Jerome is currently an Applications Engineer at MicroConnex Corporation in Snoqualmie, WA for flex circuit board fabrication.

 

Event Sponsor:

Aerotek

 

Registration:

Eventbrite - IPC Designers Council - Cascade Chapter Meeting - August

 

Location:

Lake Washington Institute of Technology – Kirkland Campus
Room A102
11605 132nd Ave NE
Kirkland, WA 98034 

Park in the south lot off of 132nd Ave NE. Room A102 is located in the south-east corner of the building, on the 1st floor.

Campus Map